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Introduction
  1. The disassembly operation of existed machines. 
  2. The movement of machine to fixed place.
  3. The hardware modification requirement for the machine specification change.
  4. The adjustment and test operation after machine assembly.

Specification
  • TFT : G2.5 ,3 , 4.5, 5.5, 6, 7.5 generation.
  • YAC Dry Etcher.
  • IC.
  • PSC 6",8"(Ultima).
  • SA2000.
  • WIN 80 .